Exceleram Announces New Memory Modules And 8 GB Dual Kits With Hynix CFR Chips
Exceleram announced some new memory modules and 8 GB dual channel kits with Hynix CFR chips. “Our new “X Series” is now ready,” said Mr. Kent Lee, Marketing Director, Exceleram. Following is the overview of the X Series with the Hynix CFR Chips:
- E30106X 2GB (1x2GB) 1333MHz, CL9, 1.5V, w/o Heatsink
- E30112X 4GB (1x4GB) 1333MHz, CL9, 1.5V, w/o Heatsink
- E30149X 4GB (1x4GB) 1600MHz, CL11, 1.5V, w/o Heatsink
- E30146X 4GB (1x4GB) 1600MHz, CL9, 1.5V, w/o Heatsink
- E30150X 4GB (1x4GB) 1866MHz, CL9, 1.65V, w/o Heatsink
- E30138X 8GB (2x4GB) 1866MHz, CL9. 1.65V, Black Sark Heatsink
- E30149XB 4GB (1x4GB) 1600MHz, CL11, 1.5V, Black PCB, w/o Heatsink
- E30146XB 4GB (1x4GB) 1600MHz, CL9, 1.5V, Black PCB, w/o Heatsink
- EBW301X 8GB (2x4GB) 1600MHz, CL9, 1.5V, Black PCB, White Sark Heatsink
- E30150XB 4GB (1x4GB) 1866MHz, CL9, 1.65V, Black PCB, w/o Heatsink
- E30138XB 8GB (2x4GB) 1866MHz, CL9. 1.65V, Black PCB, Black Sark Heatsink
For more information, please visit www.exc.com.tw/.
